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Limited By: Subject = Flip chip technology;
4 items found
 
Displaying Results 1 - 4 of 4 on page 1 of 1
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A simulation-based design method to transfer surface mount RF system to flip-chip die implementation (2010)
Zheng, Liqiang; Rodgers, Kenneth; Mathewson, Alan; O'Flynn, Brendan; Hayes, Michae...
University College Cork
Conference item
non-peer-reviewed
Science Foundation Ireland
Mark
Effect of solder volume on joint shape with variable chip-to-board contact pad ratio (2008)
Jesudoss, Pio; Mathewson, Alan; Wright, William M. D.; O'Flynn, Brendan; Stam, Frank
University College Cork
Conference item
peer-reviewed
Enterprise Ireland
Mark
Miniaturization of wireless sensor network nodes (2010)
Zheng, Liqiang; Mathewson, Alan; O'Flynn, Brendan; Hayes, Michael; Ó Mathúna, S. Cian
University College Cork
Journal article
peer-reviewed
Science Foundation Ireland
Mark
University College Cork
Conference item
peer-reviewed
Science Foundation Ireland
Displaying Results 1 - 4 of 4 on page 1 of 1
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