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System packaging & integration for a swallowable capsule using a direct access sensor
Jesudoss, Pio; Mathewson, Alan; Wright, William M. D.; McCaffrey, Colm; Ogurtsov, Vladimir I.; Twomey, Karen; Stam, Frank
Technological developments in biomedical microsystems are opening up new opportunities to improve healthcare procedures. Swallowable diagnostic capsules are an example of this. In this paper, a diagnostic capsule technology is described based on direct-access sensing of the Gastro Intestinal (GI) fluids throughout the GI tract. The objective of this paper is two-fold: i) develop a packaging method for a direct access sensor, ii) develop an encapsulation method to protect the system electronics. The integrity of the interconnection after sensor packaging and encapsulation is correlated to its reliability and thus of importance. The zero level packaging of the sensor was achieved by using a so called Flip Chip Over Hole (FCOH) method. This allowed the fluidic sensing media to interface with the sensor, while the rest of the chip including the electrical connections can be insulated effectively. Initial tests using Anisotropic Conductive Adhesive (ACA) interconnect for the FCOH demonstrated good electrical connections and functionality of the sensor chip. Also a preliminary encapsulation trial of the flip chipped sensor on a flexible test substrate has been carried out and showed that silicone encapsulation of the system is a viable option.
Keyword(s): Flip chip over hole; FCOH; Direct-access sensor; Flexible substrate; Anisotropic Conductive Adhesive; ACA; Polysiloxane
Publication Date:
2009
Type: Conference item
Peer-Reviewed: Yes
Language(s): English
Institution: University College Cork
Funder(s): Enterprise Ireland; Health Research Board
Citation(s): Jesudoss, P., Mathewson, A., Wright, W. M. D., McCaffrey, C., Ogurtsov, V., Twomey, K. and Stam, F. (2009) 'System packaging and integration for a swallowable capsule using a direct access sensor', Microelectronics and Packaging Conference, 2009. EMPC 2009. European, 15-18 June 2009 2009. 1-4. IEEE.
Publisher(s): IEEE
File Format(s): application/pdf
Related Link(s): http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=5272917
First Indexed: 2016-07-13 05:49:08 Last Updated: 2017-09-06 06:30:44