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Silver nanowire array-polymer composite as thermal interface material
Xu, Ju; Munari, Alessio; Dalton, Eric; Mathewson, Alan; Razeeb, Kafil M.
Silver nanowire arrays embedded inside polycarbonate templates are investigated as a viable thermal interface material for electronic cooling applications. The composite shows an average thermal diffusivity value of 1.89x10(-5) m(2) s(-1), which resulted in an intrinsic thermal conductivity of 30.3 W m(-1) K(-1). The nanowires' protrusion from the film surface enables it to conform to the surface roughness to make a better thermal contact. This resulted in a 61% reduction in thermal impedance when compared with blank polymer. An similar to 30 nm Au film on the top of the composite was found to act as a heat spreader, reducing the thermal impedance further by 35%. A contact impedance model was employed to compare the contact impedance of aligned silver nanowire-polymer composites with that of aligned carbon nanotubes, which showed that the Young's modulus of the composite is the defining factor in the overall thermal impedance of these composites.
Keyword(s): Carbon nanotubes; Composite material interfaces; Gold; Metallic thin films; Nanocomposites; Nanowires; Polymers; Silver; Surface roughness; Thermal conductivity; Thermal diffusivity; Young's modulus
Publication Date:
2009
Type: Journal article
Peer-Reviewed: Yes
Language(s): English
Institution: University College Cork
Funder(s): Enterprise Ireland; Science Foundation Ireland
Citation(s): Xu, J., Munari, A., Dalton, E., Mathewson, A. and Razeeb, K. M. (2009) 'Silver nanowire array-polymer composite as thermal interface material', Journal of Applied Physics, 106(12), 124310 (7pp). doi: 10.1063/1.3271149
Publisher(s): AIP Publishing
File Format(s): application/pdf
Related Link(s): http://aip.scitation.org/doi/10.1063/1.3271149
First Indexed: 2017-09-21 06:37:11 Last Updated: 2017-09-27 06:38:15