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Integrated microinductors on semiconductor substrates for power supply on chip (Invited)
Rohan, James F.; Casey, Declan P.; O'Brien, Joe; Hegarty, Margaret; Kelleher, Anne-Marie; Wang, Ningning; Jamieson, Brice; Waldron, Finbarr; Kulkarni, Santosh; Roy, Saibal; Ó Mathúna, S. Cian
Microinductors were fabricated using electrodeposition for integration on semiconductor substrates. The process was optimised through validated models developed to focus on efficiency and footprint. Lithographic processing was performed to microfabricate Cu coils over a magnetic core. A racetrack design was used to maximise the high frequency response, yielding high inductance density and low DC resistance. The magnetic core was subsequently closed using a magnetic thin film deposition over a dielectric deposited on the Cu coils. Homogeneous ferromagnetic alloy, Ni45Fe55 of uniform thickness over a high aspect-ratio 3D structure has been achieved. Ni45Fe55 was chosen for the fabrication of micromagnetic cores due to its relatively high saturation flux density (1.6 T), resistivity (48 mΩ cm) and anisotropy field (9.5 Oe). The rationale, design, microfabrication process and characterisation results are presented.
Keyword(s): Aspect ratio; Gallium nitride; Magnetic cores; Magnetic thin films; Silicon carbide; 3D Structure; Anisotropy field; Dc resistance; Ferromagnetic alloys; High aspect ratio; High frequency response; Lithographic processing; Micro inductors; Microfabrication process; Micromagnetics; Power supply-on-chip; Saturation flux density; Semiconductor substrate; Thin-film depositions
Publication Date:
2011
Type: Journal article
Peer-Reviewed: Yes
Language(s): English
Institution: University College Cork
Funder(s): Enterprise Ireland; Higher Education Authority
Citation(s): Rohan, J. F., Casey, D., O'Brien, J., Hegarty, M., Kelleher, A.-M., Wang, N., Jamieson, B., Waldron, F., Kulkarni, S., Roy, S. and O'Mathuna, S. C. (2011) '(Invited) Integrated Microinductors on Semiconductor Substrates for Power Supply on Chip', ECS Transactions, 41(8), pp. 341-347. doi: 10.1149/1.3631510
Publisher(s): Electrochemical Society
File Format(s): application/pdf
Related Link(s): http://ecst.ecsdl.org/content/41/8/341
First Indexed: 2019-03-12 06:31:43 Last Updated: 2019-03-12 06:31:43