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Electroless cobalt deposition from ammonia borane solutions
Rohan, James F.; Nagle, Lorraine C.; Loughlin, Alan
Ammonia borane (AB) has been used as a reducing agent in the deposition of cobalt on copper substrates. The bath composition for selective deposition was investigated. The mobile ion free plating bath was pH balanced and buffered using tetramethyl ammonium hydroxide. The codeposition of W with Co was achieved utilising tungstic acid. The electrochemical analysis of cobalt deposition and AB oxidation at the operating pH of 9 indicate that the deposition on copper is faster than that on cobalt and that the reaction rate decreases as the deposition proceeds.
Keyword(s): Cobalt; Electrodeposition; Electroless plating; Oxidation; Oxides; pH effects; Substrates; Ammonia borane solutions; Cobalt deposition; Copper substrates
Publication Date:
Type: Journal article
Peer-Reviewed: Yes
Language(s): English
Institution: University College Cork
Citation(s): Rohan, James F.; Nagle, Lorraine C.; Loughlin, Alan (2007) 'Electroless Cobalt Deposition from Ammonia Borane Solutions'. ECS Transactions, 2 (6):51-59.
Publisher(s): Electrochemical Society
File Format(s): application/pdf
Related Link(s):
First Indexed: 2019-03-14 06:31:42 Last Updated: 2019-03-14 06:31:42