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Micro-transfer-printing for heterogeneous integration
Corbett, Brian; Li, Zhi; Buehler, K.; Naumann, F.; Krieger, U.; Wicht, S.; Bower, C. A.
Micro-transfer-printing is a key enabling technology for the heterogeneous integration of different materials and devices. The technique is particularly applicable to photonics where a typical system requires diverse arrays of components.
Keyword(s): Integrated optics; Microassembling; Printing; Microtransfer-printing; Heterogeneous integration; Photonics; Silicon; Substrates; Surface treatment; Dielectrics; Polymers; III-V semiconductor materials
Publication Date:
2019
Type: Conference item
Peer-Reviewed: Yes
Language(s): English
Institution: University College Cork
Funder(s): Science Foundation Ireland
Citation(s): Corbett, B., Li, Z., Buehler, K., Naumann, F., Krieger, U., Wicht, S. and Bower, C. A. (2019) 'Micro-transfer-printing for heterogeneous integration', 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D), Kanazawa, Japan, 21-25 May, p.34. doi: 10.23919/LTB-3D.2019.8735381
Publisher(s): Institute of Electrical and Electronics Engineers (IEEE)
File Format(s): application/pdf
Related Link(s): https://ieeexplore.ieee.org/document/8735381,
http://www.jsps191.org/ltb3d-2019/
First Indexed: 2020-02-13 07:29:26 Last Updated: 2020-02-13 07:29:26