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Additive influence on Cu nanotube electrodeposition in anodised aluminium oxide templates
Chowdhury, Tamjid; Casey, Declan P.; Rohan, James F.
Anodised aluminium oxide (AAO) templates have been utilised to investigate Cu deposition from a typical sulphate plating bath. The influence of the common additives poly ethylene glycol (PEG), chloride ion (Cl-) and Bis-(sodium sulphopropyl)-disulphide (SPS) on the deposition process has been analysed. The growth of Cu wires or nanotubes (with tube walls of 40-70 nm) is significantly influenced by the action of the additives. In the presence of either Cl- or SPS solid wire growth is observed, however, when PEG is added with Cl- the growth of ordered Cu nanotubes is observed. SPS added to a bath containing Cl- and PEG restores the growth of wires.
Keyword(s): Templates; AAO; Copper; Electrodeposition; Nanotubes; Additives; PEG; CL; Polyethylene glycol; Growth-mechanism; Nanowire arrays; Deposition; Fabrication; Chloride
Publication Date:
2009
Type: Journal article
Peer-Reviewed: Yes
Language(s): English
Institution: University College Cork
Funder(s): Irish Research Council for Science Engineering and Technology
Citation(s): CHOWDHURY, T., CASEY, D. P. & ROHAN, J. F. 2009. Additive influence on Cu nanotube electrodeposition in anodised aluminium oxide templates. Electrochemistry Communications, 11, 1203-1206. http://dx.doi.org/10.1016/j.elecom.2009.04.003
Publisher(s): Elsevier
File Format(s): application/pdf
Related Link(s): http://www.sciencedirect.com/science/article/pii/S1388248109001672
First Indexed: 2014-01-23 05:37:37 Last Updated: 2016-10-14 06:05:15